Facile modification of freestanding silicon nitride microcantilever beams by dry film photoresist lithography

A photolithographic technique based on dry film photoresists for facile and low-cost patterning of microcantilever beams is presented. Dry film photoresists enable instantly homogenous photoresist coatings on flexible and 3D patterned substrate surfaces, represented here by microcantilever beams, which is otherwise challenging if conventional spin-coating of photoresist is utilized. Compared to alternative microtechnologies, such as focused ion beam milling or resist spray coating, our strategy is far less elaborate, fully compatible with routine additive and subtractive microfabrication processes and can be readily scaled. We show specifically microcantilever shape modification by CF4 reactive ion etching, localized metal deposition in combination with conventional lift-off procedures as well as a utilization of patterned dry film photoresists as permanent microstructural elements. These microstructural elements are in particular flat-ended cylindrical dry resist micropillars created at the freestanding end of the cantilever beam that can be employed as scanning probes. The resist pillars enabled imaging of a 3T3 mouse fibroblast cell culture surface to determine their elastic force constants. Alongside UV-exposure by a conventional mask aligner, we also demonstrate dry film photoresist exposure by contact-free laser lithography eliminating possible substrate damage by photomask contact.